[Ceatec] Sony Develops 2nd-gen TransferJet Chip
Sony Corp developed the "CXD3270GG," the second-generation transceiver chip that supports the "TransferJet" short-range wireless standard.
As for interfaces, it is compatible with PCI Express and USB 2.0. The first-generation product supports either PCI or SDIO. Therefore, to use PCI Express and USB 2.0 with the first-generation product, a bridge chip and a general-purpose microcontroller, respectively, are required. In fact, Sony's transceiver module using the first-generation product has such a composition.
Effective speed increases
The second-generation transceiver chip has the following three characteristics that were achieved by improving both hardware and software. First, its effective data transmission speed is as high as 300Mbps when files are exchanged between devices equipped with the chip.
This time, Sony developed a module using the CXD3270GG and showed a demonstration of transferring data files by using a PC equipped with the module. And the company transmitted a 180-Mbyte video file at a speed of about 350Mbps. The speed is faster than the transmission rate of the module made with the first-generation product (110-190Mbps) partly because the first-generation product uses a bridge to support PCI Express or USB 2.0.
Sony claims that the CXD3270GG enables not only large-size, high-performance notebook PCs but also small-size, low-performance notebook PCs, tablet PCs and embedded devices to transfer files at a rate higher than 300Mbps.
Second, the second-generation chip consumes less power. Though it depends on operation mode, the power consumption of the chip is 500 to 600mW for transferring data at 300Mbps. This was realized by, for example, reducing the processing load of the CPU of a PC equipped with the CXD3270GG. The power consumption of the first-generation chip is about 1W for transferring data at 110-190Mbps.
Third, Sony reduced the BOM (bill of materials) needed to make a module. It became possible because the CXD3270GG does not need the bridge chip and other parts used by the first-generation chip.
The CXD3270GG will be packaged in 246-pin VFBGA packaging. It measures 13 x 12 x 1.0mm. Sony is now shipping samples of the chip, planning to mass-produce it at the end of 2010. The price of the sample is ¥1,800 (approx US$21.18).
The company plans to exhibit the chip at Ceatec Japan 2010, which will take place from Oct 5 to 9, 2010, in Chiba Prefecture, Japan.