[3G iPod shuffle Teardown] SoC, Flash Memory Stacked [Part 4]

Apr 6, 2009
Nikkei Electronics Teardown Squad

Continued from [3G iPod shuffle Teardown] Chassis Hard to Open (as Always) [Part 3].

The L-shaped main board removed from the chassis was about 20.7mm long and 14.2mm wide. The semiconductor package with Apple's logo is printed with characters like "K9HB608U1A-BCBC" and "8442A ARM." The semiconductor package, which measures 8.5 x 12.5mm, occupies most of the area on the main board.

"Judging from this mark, this semiconductor must be manufactured by Samsung Electronics," the engineer said. "The second-generation iPod shuffle is also mounted with Samsung's SoC."


One side of the main substrate is largely covered by one semiconductor package.

SoC, flash memory staked

On the back of the main board, there are a few small ICs (about 1.2 x 1.2mm in size), two crystal oscillators and some passive components such as a coil. The first- and second-generation iPod shuffles are equipped with two large ICs, which are an SoC (system on chip) and flash memory. On the other hand, the third-generation product has only one large IC. The semiconductor package with Apple's logo seemed to contain both an SoC and flash memory.

The secondary battery is connected by a flexible substrate solder-mounted behind the main board. The battery is printed with letters such as "LIP 3.7V" and "Whr: 0.27Whr." Probably, it is a 3.7V Li-polymer secondary battery with a power capacity of 0.27Wh.


The secondary battery is connected by a flexible substrate soldered on the board.