Google Earth Used to Design Chips in 3D

Apr 3, 2008
Ikutaro Kojima, Nikkei Microdevices
Google Earth is used to show 3D images. The data provided by Gem Design Technologies.
Google Earth is used to show 3D images. The data provided by Gem Design Technologies.
[ If it clicks, the expanded picture will open ]
"Super Stratum Design Function"
"Super Stratum Design Function"
[ If it clicks, the expanded picture will open ]
Power rings can be easily divided.
Power rings can be easily divided.
[ If it clicks, the expanded picture will open ]

Gem Design Technologies Inc announced the latest version of its EDA tool "GamPackage," which was developed by Murata Design Tech, the predecessor of the company, for the schematic designs of LSI and SiP packages.

Murata Design Tech changed its name to Gem Design Technologies April 1, 2008, and, at the same time, announced several new features of the software. For example, the software can now show 3D designs. The company realized it by adding the function of outputting the design information of package boards as the data of 3D constructions for Google Earth (KMZ format).

The functions of Google Earth enable to show the designs from all angles. Also, it is possible to highlight, for example, a specific net in 3D.

Furthermore, Gem Design Technologies added "Super Stratum Design Function" for the schematic designs of PoP (package on package). This function is for simultaneously displaying and modifying several substrates that have different design rules including PoP.

"Conventional EDA products, when a substrate is designed by a design rule, deal another substrate designed by a different rule as a black box," said Hiroshi Murata, president of the company. "With this version of GemPackage, it is possible to show and modify all the substrates that have different designs rules."

There are more new functions. For example, solid surfaces of a substrate can be applied to several power planes, and power rings can be easily divided.

Furthermore, in the case where substrates are designed with undecided chip specifications, the software has a function to automatically assign chip I/Os by using the ratio of signal, power and ground I/Os, the total number of I/Os and so on.