[CEATEC Preview] Toko Reduces Footprint of Wireless LAN Module by 40% Using Component Embedded Substrate

Oct 2, 2007
Mayuko Uno, Nikkei Electronics

Toko Inc. developed the TMW1145, a wireless LAN module, whose footprint is reduced by about 40% with the adoption of a component embedded substrate.

The new module is compliant with the IEEE802.11n standard. The dimensions are 6.5 mm x 10 mm x 1.4 mm. The company plans to start shipping samples in October 2007 and begin volume production in January 2008. The expected sample price is about 10,000 yen.

In the latest module, a communication LSI chip that integrates RF, baseband and MAC processing circuits and a power control LSI chip are both sealed in wafer level CSPs. Then the CSPs are embedded in a printed circuit board with a thickness of 0.7 mm. The transmission, reception and standby power consumptions of the module are 300 mA, 180 mA and 0.5 mA, respectively.

The Toko's latest product is on display at CEATEC JAPAN 2007, which is being held from Oct. 2, 2007. The company plans to demonstrate sending and receiving video data between a notebook computer acting as a server machine and a PDA device.