
Cover Story
Technological innovation in manufacturing and materials
LSI
- Report Trend report from SEMICON Japan 2008:Wafer diameter increases to 450 mm
- Report STARC organizes a guidebook for IP core verification
FPD
- Report Material applied to integrate retardation film with color filter
Energy
- Inside Latest trends in Chinese photovoltaic industry
- Report LED lighting user survey
Tutorial FPD
Positive cycle” of technology development and commercialization brought LCD up to market giant (10)
MEMS
- Report MEMS technology trends found in SEMICON Japan 2008
Emerging Technology
Using self-assembly in LSI interconnect process
Key Word
Concentrating solar power generation
Key Person
Business strategy of Rohm turning to “More than Moore”
Interview
Semiconductor technology strategy of Applied Materials
Challenger
Using Cu-Mn alloy to reduce interconnection resistance in large FPD
Watcher/International
Worlds latest news







