
Cover Story
Break through the barrier of LSI with MEMS
Special Feature
Technology appears that overcomes issues of high-k/metal gate
LSI
- Inside Toshiba develops cleaning process reducing environmental load and chemical cost
- Report Device manufactures make inroads into bio/medical market
- Report Matsushita Electric Industrial starts to roll out 45nm-generation SoC
Tutorial LSI
Comprehensive list of inspection equipment technologies that break through the barrier of 45nm (4)
Energy
- Report Companies in exploding China’s photovoltaic industry join in thin film systems in succession
- Report SiC power semiconductors produce a succession of the fruits
FPD
- Inside Sony makes flexible organic TFT for future OLED panel
- Report Taiwan LCD manufacturers rushing on an expansionary course deploy products covering all fields
- Report Prices of LCD TV continue to decline by 20% per year until 2011
Tutorial FPD
“Positive cycle” of technology development and commercialization brought LCD up to market giant (5)
EDA
- Inside Toshiba develops C-based design and verification system for SoC
Emerging Technology
Connector with 1/3 of contact height
Key Word
3-dimensional LSI
Key Person
Toshiba’s semiconductor business strategy
Key Person
Sony says, “We will produce TV sets, which are a source of pride for Sony, with organic EL technology”
Interview
E-shuttle talks, “We are developing an LSI prototype service with electron beam lithography”
Watcher/International
Worlds latest news
New Products
Scanning probe microscope/Pacific Nanotechnology Inc.
Lens for larger line sensor camera/Nikon Corp.
IC layout data viewer/TOOL Corp.
Oil-free scroll vacuum pump/ANEST IWATA Corp.







