
Cover Story
"Mieru"(visualized)fab wins out in SoC production
through implementation of information technology
Special Feature
Are large-scale investments in LSI and FPD all right?
LSI
[Report]TSMC's strategy on semiconductor manufacturing process
[Report]SONOS embedded memory realized by CMOS process
[Report]Fujitsu develops new material for FeRAM
[Report]Samsung introduces through silicon via interconnection technology to memory cards
[Report]Sanyo Electric's SoC for portable VCR, "Platinum Engine"
FPD
[Inside]LCD televisions manufactured outside Japan are catching up in image quality
EDA
[Inside]Exploring the capabilities of a new transistor model
MEMS
[Report]Ricoh develops three-axis acceleration sensor with plastic package
[Report]US SiTime to start mass-production of Si resonator
Tutorial
Overview of process equipment technology analyzed through the front-runner (5): Interconnection process
Emerging Technology
Inkjet technology with 1/1000 droplet volume
Key Word
ZnO
Key Person
AMD, "we can compete with Intel even with just two fabs"
Interview
Harison Toshiba Lighting, "the mainstream light source for LCD televisions will continue to be CCFL
Challenger
CTO of US JEDA Technologies gives focus to SystemC's verification technology
Watcher/International
World's latest news
New Products
- MEMS accelerometer tester/Tokyo Electron Ltd.
- Room temperature wafer bonding system / Mitsubishi Heavy Industries, Ltd.
- Linear Actuator/ NSK Ltd.
- Conductive Wiper for Clean Room Use/Mitsubishi Paper Mills Ltd.
- Laser diffraction particle size analyzer/Shimadzu Corp.
- Functional Verification EDA/Mentor Graphics Co







