
Cover Story
Sanyo, Back on Track after Earthquake
Special Feature
Wafer thickness reduced to 2 µm
LSI
[Inside] Cortex-A8, a new-generation ARM core, marks 1 GHz operation at 65nm
[Report] "IEDM 2005" preview:New combinations of processes appear in succession
[Report] "Competition for dominance gets fiercer in oxide film etching equipment - Conventional
plasma etching is winning"
[Report] Featured SoC development (2):Sony's SoC "HD Codec Engine" for HD digital video
[Report] DRAMs break through their limitations with capacitor-less structure
[Report] "ISSM 2005" [Report]:Cooperation of APC and DFM is the key
[Report] Samsung secures reliability and yield with its proprietary circuit simulator
FPD
[Inside] Flash [Report] from "FPD International 2005"
[Report] Quantitative assessment of image quality of "Sony panels"
MEMS
[Inside] Analyzing the winner group of MEMS companies
Emerging Technology
Laying out nano-size wire inside Si crystal
Key Word
"PRAM"
Key Person (1)
Displaystrategy of Matsushita - It takes the offensive across the world with promo phrase of "Thin, Digital, and HD"
Key Person (2)
"The ideal state of Japanese semiconductor industry" that the METI expects to see
Interview
Focusing on creating a flexible organization good at dealing with environmental changes
New Products
- Five line confocal microscope/ Lasertec Corp.
- Ion milling system/Hitachi High-Technologies Corp.
- Film thickness measurement system/Rudolph Technologies, Inc.
- IC power grid verification software/Sequence Design, Inc.
- Wafer imaging system/Cascade Microtech, Inc.
- Transfer robot/Yaskawa Electric Corp.







