Cover Story
Buying Out the Time:
The Way of Future Technology Development
Special Feature
"Japan had been losing in technological areas"
LSI
Inside Calypto develops EDA tool that can verify sequential circuit equivalence
Report Featured SoC development(1) : CCD signal processing LSI for Canon's DIGIC DV
Report Intel reaches out to ReRAM in their next-generation non-volatile memory strategy
Report China's semiconductor industry will reach a level where they can compete in the global market by 2008
FPD
Inside Flat panel television image quality will improve without fail,challenges will be
overcome while achieving "1-inch = 10,000 yen"
Report Yield exceeds 90 percent, China's TFT LCD plants go into gear
Report Revolution in color filter production, production using inkjet technology begins
New Technology
Inside MEMS changes mobile phone user interface
Tutorial
Verifying intrinsic parameter fluctuations in nanoscale CMOS devices
Emerging Technology
New packaging technology developed
Key Word
"16G bit NAND"
Key Person
Samsung's strategy on LCD panels
Samsung's strategy on logic LSIs for mobile devices
Interview
Facilitating customer's development by offering chip analysis technology
Challenger
Etching technology for MEMS further increases speed
New Products
Immersion ArF lithography tool / ASML Lithography
Immersion ArF lithography tool / Nikon Corp.
Vacuum evaporation tool for organic electroluminescence / Hitachi Zosen Corp.
Memory test system / Agilent Technologies, Inc.
Static timing analyzer / Incentia Design System, Inc.
Dry etching equipment for stress relief process / DISCO Corp.
