Asahi Glass Reduces Heat Shrinkage of Glass Substrate by 80%

May 15, 2013
Mami Akasaka, Tech-On!
The "AN Wizus" (photo courtesy of Asahi Glass)
The "AN Wizus" (photo courtesy of Asahi Glass)
[Click to enlarge image]

Asahi Glass Co Ltd will release the "AN Wizus" glass substrate, which does not shrink much in the high-temperature thermal process, in May 2013.

The glass substrate is targeted at the displays of smartphones and tablet computers. With the substrate having a low heat shrinkage rate, the company expects to improve the product quality and productivity of high-resolution panels.

Asahi Glass manufactures glass substrates by using the float process, which has a slow cooling process and is suited for the production of glass with a low heat shrinkage rate. For the AN Wizus, the company also made improvements to glass composition in the aim of reducing thermal shrinkage. When the new glass is heat-treated for 10 minutes at a temperature of 600°C, its shrinkage is 7ppm, which is about 1/5 that of the "AN100", the company's existing product.

The stiffness (Young's modulus) of the new glass substrate is 85GPa, which is higher than that of the AN100 (77GPa). And its photoelastic constant is 27nm/cm/MPa while that of the AN100 is 31nm/cm/MPa. Furthermore, the Asahi Glass improved the speed of the process of reducing the thickness of a panel by 10%.

Asahi Glass will exhibit the AN Wizus in its booth at the Society for Information Display (SID), a trade show that will take place from May 20, 2013, in Vancouver, Canada.