Sony's Thermal Conductive Sheet Expected to Replace Thermal Grease

Jul 14, 2012
Ikutaro Kojima, Tech-On!
The cooling capabilities of thermal grease and the new sheet were compared. The "CPU0" and "CPU1" were cooled by the thermal grease and the sheet, respectively.
The cooling capabilities of thermal grease and the new sheet were compared. The "CPU0" and "CPU1" were cooled by the thermal grease and the sheet, respectively.
[ If it clicks, the expanded picture will open ]

Sony Chemical & Information Device Corp exhibited a prototype of a sheet whose thermal conductivity is equivalent to that of thermal grease at Techno-Frontier 2012, which took place from July 11 to 13, 2012, in Tokyo (booth number: 5E-112).

The product life of the sheet, "EX20000C," is longer than that of thermal grease, which is degraded by pumping out, the company said.

The high thermal conductivity was realized by using silicon highly-filled with carbon fibers. The sheet is 0.3-2.0mm thick. Its thermal resistance is 0.4-0.2K·cm2/W (compressive load: 1-3kgf/cm2), which is 1/6 to 1/5 that of the "EX50000," Sony Chemical & Information Device's existing product.

"The EX20000C is the first sheet that has such a low thermal resistance," the company said.

Sony Chemical & Information Device expects that the new sheet will be employed for servers, high-end projectors, etc. At the company's booth, it used thermal grease and the sheet to cool microprocessors for comparison. When I saw the demonstration, a microprocessor cooled by the new sheet was 3°C cooler than that cooled by the thermal grease.