Silver Ink Enables to Form Circuits Without Heat

Jan 18, 2012
Tsuneyuki Miyake, Tech-On!
Electronic circuits formed by using the new Ag ink and a flexographic printing method (photo courtesy of Tanaka Holdings Co Ltd)
Electronic circuits formed by using the new Ag ink and a flexographic printing method (photo courtesy of Tanaka Holdings Co Ltd)
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A sample product made by using the Ag ink
A sample product made by using the Ag ink
[ If it clicks, the expanded picture will open ]

Tanaka Kikinzoku Kogyo K.K. developed a conductive silver (Ag) ink that can be hardened only by applying ultraviolet light to it.

It enables to form electronic circuits at room temperature without heating process. As a result, heat-labile flexible materials can be used as substrates.

The new Ag ink can be hardened by applying ultraviolet light for about 0.3 seconds. With the ink, it is possible to use heat-labile flexible materials such as polyvinyl chloride (PVC) and polyester (PET) as substrates.

The ink is expected to be used in the field of printed electronics, which forms electronic circuits by printing processes. The ink enables to reduce the size of manufacturing equipment as well as to simplify it because the ink eliminates the need for heating process. And it might help create new manufacturing methods for photovoltaic cells, OLED lighting devices, touch-sensitive displays, RFID tags, etc.

When the ink is used to form a 5μm or thicker film, its electric resistivity is 10-3Ωcm. The ink was realized by optimizing the compositions of the resin contained in Ag particles and initiating reagent and their ratios.

Tanaka Kikinzoku Kogyo used different resins and initiating reagents to develop three types of the ink. It will exhibit the new ink at the 41st Internepcon Japan, which runs from Jan 18 to 20, 2012, in Tokyo.