Thorough Comparison Between iPhone 2G and 3G

In the iPhone 3G, a number of main parts, including the RF circuit, the baseband circuit and the application processor, are mounted on a single printed circuit board (main board). In the iPhone 2G, the wireless circuit board was separate from the main board. The purposes of the parts are estimated by Nikkei Electronics.

In the iPhone 3G, a number of main parts, including the RF circuit, the baseband circuit and the application processor, are mounted on a single printed circuit board (main board). In the iPhone 2G, the wireless circuit board was separate from the main board. The purposes of the parts are estimated by Nikkei Electronics.

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