2008 Wrap Up: iPhone 3G Teardown

Fig 3: A sign of Apple's struggle to cut down on noise? The stainless shields that covered the main board seen from the back side. Apple seems to have plated copper on the back of the shield that covers the area where application processor, display interface IC and touch panel controller IC are packaged, to enhance its measures against noise.

Fig 3: A sign of Apple's struggle to cut down on noise? The stainless shields that covered the main board seen from the back side. Apple seems to have plated copper on the back of the shield that covers the area where application processor, display interface IC and touch panel controller IC are packaged, to enhance its measures against noise.

Close