2008 Wrap Up: iPhone 3G Teardown

Fig 2: The iPhone 3G's main board. Major components packaged on one side. Many of the key components including RF circuit, base band circuit and application processor are mounted on one side (the side of the display) of the substrate. Only a few components including flash memory and wireless LAN/Bluetooth transmission module are embedded on the side of the Li-polymer secondary battery. It measures about 84.3 x 53.8mm with a thickness of about 0.7mm. It appears to be an 8-layer substrate. The names of the manufacturers and the purposes of the components were estimated by Nikkei Electronics.

Fig 2: The iPhone 3G's main board. Major components packaged on one side. Many of the key components including RF circuit, base band circuit and application processor are mounted on one side (the side of the display) of the substrate. Only a few components including flash memory and wireless LAN/Bluetooth transmission module are embedded on the side of the Li-polymer secondary battery. It measures about 84.3 x 53.8mm with a thickness of about 0.7mm. It appears to be an 8-layer substrate. The names of the manufacturers and the purposes of the components were estimated by Nikkei Electronics.

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