Toshiba to Adopt Energy Saving Technology for 300mm Line

Mar 7, 2008
Masahide Kimura, Nikkei Electronics

Toshiba Corp will introduce its technology to reduce energy consumption at semiconductor plants by cutting the amount of cleaning wind circulated in clean rooms to the 300mm wafer line at its Oita Operations.

Currently advancing discussions on technical issues, the company is considering operating the technology at its Oita Operations as early as the first half of 2008. Toshiba introduced the technology at its 17th Toshiba Group Environmental Exhibition held March 6, 2008.

The technology reduces the amount of wind generated by FFUs (fan filter units) without affecting temperature distribution in the clean room and production yields, in an effort to save energy. After actually verifying the technology on the 150 and 200mm wafer lines at its Oita Operations, Toshiba confirmed a cost reduction of about ¥38.5 million in the year from June 2006 to May 2007. On a CO2basis, Toshiba said the effects correspond to a reduction of 1,811t.

To determine the conditions that don't affect temperature distribution and yields, Toshiba divided a clean room with a floor space of roughly 10,000m2 into 480 areas and measured the temperature, wind speed and the amount of particles in each area. Conducting simulations based on the measured data, the company conserved energy by controlling the total amount of wind generated by somewhere around the 3,300 FFU level every 10 to 12 units, Toshiba said.

The company is considering operating the technology at the 300mm line at its Oita Operations as well as its Yokkaichi Operations manufacturing NAND flash memory in the future.