[iPhone Breakdown Part 4] Flash Memory Chip is Supplied by Samsung, Display is 3.5 mm Thick [Video]

Jul 4, 2007
Tomohisa Takei, Nikkei Electronics

The engineers proceeded to remove the shield that covered a part of the main module (Figure 1) after examining the two-layered main board (See related article).

Figure 1: Removing the shield that covers a flash memory chip.

The flash memory chip under the shield turned out to be a product of Samsung Electronics Co. Ltd. The chip is marked "SAMSUNG 710" and "K9HBG08U1M," and the dimension of the package including the terminal area is approximately 20.5 mm × 12 mm (Figure 2). Note that a 4-GB iPhone was disassembled.

Figure 2: The word "SAMSUNG" printed on the flash memory chip

A chip that seemed to be an acceleration sensor was also found under the shield. It is the rightmost and about 5 mm × 3 mm chip mounted under the flash memory chip in Figure 2.

From the mark "302D," the engineers assumed that it was an acceleration sensor developed by STMicroelectronics of Italy and France.

Examining the display module

One of the features of iPhone is a 3.5-inch touch panel display. After studying the circuit boards, the engineers began to pull out the display module from the chassis. And, by removing a silver frame fixed by screws and inserting a tool from the lower part of the iPhone's front face, the display module was detached.

The thickness between the glass on the surface of iPhone and a reflecting sheet attached to the LCD is approximately 3.5 mm (figure 3). The thickness of the LCD is less than 2 mm, but "it's not particularly thin," an engineer said. It is probably an ordinary LCD.

Figure 3: The thickness of the display module is about 3.5 mm.

The display module is mounted with two flexible substrates that are connected with the main module at the connectors. Apparently, the substrate for the LCD is in the background, and the substrate for the touch panel is in the foreground, in Figure 3.

The components and layouts of the main parts became clear by disassembling an iPhone. However, there are some circuit boards tightly covered by shields and parts covered by resin. So, we cannot stop working yet.

The engineers began to remove shields with soldering irons, insert tools in the gaps between resin parts and so on (Figure 4). We are coming close to the deeper abyss of the iPhone's design concept (Figure 5 and 6).

Figure 4: Removing the shield that covers the circuit board for the touch panel

Figure 5: Disassembled iPhone

Figure 6: Metal shields, insulating films, etc.

動画Break up an iPhone: Part 3 (01:36)
You need Windows Media Player to play the movie
Click the play button

Powered by BPtv