[iPhone Breakdown Part 3] Two Circuit Boards Turned out to be Wireless Module and iPod Module

Jul 3, 2007
Tomohisa Takei, Nikkei Electronics

The engineers went about analyzing the two-layered main board taken out from the chassis. And they found that the main module, which adds the functions of an iPod and others to an iPhone, and the wireless module are mounted as separate boards (See related article).

Let's check the wireless module installed on the dorsal side of the iPhone first and, then, the main module on the side of display.

The wireless module is entirely covered by a large shield. Under the shield, two chips are installed on both right and left sides of the module, and two bare chips are mounted in the middle (figure 1).

Figure 1: The wireless module that was entirely covered by a shield

The letters "1YUSM484S02" are printed on the surface of the 10 mm × 10 mm LSI located in upper right (figure 2).

"It looks like a baseband processor," an engineer said. "But it's impossible to tell the name of the manufacturer or its specifications."

The 8 mm × 10 mm LSI below the 10 mm × 10 mm LSI is marked "1030W0YT02" and is probably a flash memory chip.

The two bare chips mounted in top center are apparently a wireless-LAN and Bluetooth RF IC.

The wireless-LAN RF IC (top center) is printed with the word "MARVELL," which means it was manufactured by Marvell Semiconductor Inc. of the United States. And the word "CSR" printed on the Bluetooth RF IC (left of center) means that the IC is a product of CSR of the United Kingdom.

Figure 2: The wireless module

There is a 64-contact connector, which is connected to the main module, on the reverse side of this board .

Figure 3: The reverse side of the wireless module

Now, let's examine the main module (figure 4). The word "339S0030 ARM" is printed on the 14 mm × 14 mm LSI with the mark of an apple, and the LIS laps over the wireless module. It looks like an ARM core-based SoC.

"The head of the letter string printed on the package is 'K'," an engineer said. "This (main module) must be made by Samsung Electronics Co. Ltd of Korea."

Figure 4: The main module mounted with an ARM core-based SoC

The audio CODEC LSI, WM8758, developed by Wolfson Microelectronics of the United Kingdom is installed above the connector of the wireless module located in lower right.

"Wolfson's audio CODEC LSIs have been adopted by iPod series," an engineer said. "As expected, this circuit board carries out the functions of an iPod."

The engineers who carefully examined the circuit board realized that they did not find an LSI to compound images such as H.264.

"I guess this SoC has the function to compound images," an engineer said. And the flash memory chip is seemingly mounted under the shield with round holes.

Four connectors and a SIM card slot are mounted on the back of the main module (figure 5). By a flexible substrate, a large connector in the lower left is connected to the "dock connector" for external connection, which is located at the bottom of the iPod.

Figure 5: The back of the main module. The SIM card slot looks disproportionately large.