Front & Backside of "Intel iMac" Motherboard: Non-Intel Chips Used for I/O-associated LSIs

The heat generated in the microprocessor mounted on the backside of the board flows through a heat pipe into the heat sink. The heat sink is fixed to both the front and backside of the board such that the heat pipe and sink sandwich the board.

The heat generated in the microprocessor mounted on the backside of the board flows through a heat pipe into the heat sink. The heat sink is fixed to both the front and backside of the board such that the heat pipe and sink sandwich the board.