• BPnet
  • ビジネス
  • PC
  • IT
  • テクノロジー
  • 医療
  • 建設・不動産
  • TRENDY
  • WOMAN
  • ショッピング
  • 転職
  • ナショジオ
  • 日経電子版

Front & Backside of "Intel iMac" Motherboard: Non-Intel Chips Used for I/O-associated LSIs

The mainboard without heat sinks, etc. (front side). On the left of the center is the Intel memory controller LSI (north bridge) "82945GM (945GM)." The I/O controller LSI (south bridge) "82801GBM (ICH7-M)" is located on the right of the center. The Bluetooth and IEEE802.11 wireless LAN modules are provided at the right and lower left of the board, respectively.

The mainboard without heat sinks, etc. (front side). On the left of the center is the Intel memory controller LSI (north bridge) "82945GM (945GM)." The I/O controller LSI (south bridge) "82801GBM (ICH7-M)" is located on the right of the center. The Bluetooth and IEEE802.11 wireless LAN modules are provided at the right and lower left of the board, respectively.