Front & Back Side of "Xbox 360" Mainboard
Nikkei Electronics Tear-down Team has torn down Microsoft Corp.'s "Xbox 360" home video game console and taken out the mainboard. The board measures 268 mm in lateral direction and 210 mm in vertical direction (at the longest section). The shortest section in the vertical direction is 182 mm long. It is almost the size of "picoBTX" specification (267 x 203 mm) as in PC mainboards.
The components are aligned more neatly than expected on the front side. An IBM Corp.'s custom microprocessor operating at 3.2 GHz is disposed in the center and right next to it is a graphics LSI that is connected to the microprocessor via a high speed front side bus (FSB).
The graphics LSI package is provided by using System-in-Package (SiP) technology. An NEC Electronics Corp.'s DRAM embedded LSI and a graphics LSI made by Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) are mounted flatly and sealed in one package. The backside of the mainboard includes almost no major components but a memory LSI, giving a simple appearance.