Cover Story
Beautiful yet Tough
Part 1: Outline
Portable Devices, Now used Everywhere, Have to be Tough
In the field of portable devices such as cellphones, digital cameras, and laptop PCs, the number of "tough" models with robust characteristics such as water and shock resistance is increasing rapidly. More than merely tough, however, size- and thickness-reduction technologies have made these devices equivalent to regular versions in terms of functionality and external appearance, as well.The addition of toughness though has expanded the application scope of these devices, which in turn is creating new needs and triggering the introduction of new technologies.
Part 2: Design Concept
Different Types of Toughness, Carefully Tailored for Each Device Depending on the Application
Toughness requirements differ for individual devices. Device makers are not haphazardly adding the same ruggedness characteristics to all their products because water- and shock-resistance requirements differ depending on the device. In other words, the appropriate ruggedness characteristics must be added to suit specific applications, along with compact size and light weight.This means that there is no room for design compromise. Only those devices possessing the proper ruggedness will survive as true portable devices.
Portable Devices
Digital Cameras
Laptop PCs
Portable TVs
Remote-Controlled Devices
PNDs
Portable Devices
Special Feature
USB 3.0 Debuts: Connecting Devices at 5 Gbps
It is estimated that 2.6 billion USB (Universal Serial Bus) ports are shipped globally every year.The USB interface has become the standard in a wide range of devices, including personal computers and cellphones.Eight years following the introduction of the present version, the next-generation USB version will be launched soon.Transfer speed will jump by 10 times from the current version, entering the realm of gigabits/sec. This launch may spawn an entirely new class of USB-based devices.USB may again begin to eat into the market of other interfaces such as HDMI (High-Definition Multimedia Interface).
Will a 5000-Yen, Simple Ground-Digital Tuner Become a Reality?
Manufacturers Having Tough Time Meeting the Price Goal
LSIs for Bluetooth: Focus on Combo Chips and Low Power Consumption
Products to Support Wireless Communication for Everyone
At long last, the use of Bluetooth is beginning to spread in Japan, mainly driven by game machines and in-vehicle devices. Behind this development is the fact that Bluetooth has become a general-purpose technology, easily used even by those who know nothing about wireless communication. For those considering the use of Bluetooth devices in the near future, product types that are integrated with wireless LAN or offer low power consumption may soon become options.
Documentary
Development of Softbank Mobile “922SH” (Part 1)
ME Plus
Intellectual Property Utilization Guides for Engineers
NE Tutorial
Key Points of A-D Conversion Everyone Should Know: Part 3
Continuing from the previous article, this one compares the various performance features of ΔΣ and serial-comparisontype A-D converters. This article focuses on the concept of start/stop in ΔΣ-type data conversion, which confounds many engineers; the size of current consumption; and the high level of expandability.It goes on to describe application examples that once used the serial-comparison type but are beginning to convert to the ΔΣ type.
Designing Proper Electromagnetic Compatibility on Printed Circuit Boards(Second Half)
When designing an electronic device, one must consider electromagnetic compatibility (EMC). To minimize effects on delivery time and cost, EMC must be taken into account beginning with the printed circuit board design. This article describes the specific items of which the designer must be aware.
Academy
Session 8: Utilizing Interrupts to Achieve Processing with Precise Timing
Keyword
Non-contact/Contactless Charging
Key Person
Baidu Japan, President, Toshikazu Inoue: Center of the Internet Shifts to Asia
US-Centric Era Is Over
NE Interview
Fujitsu Microelectronics Limited, President, Haruki Okada: “Semiconductor Business Requires Unique Individuals.”
Putting Experience Gained in Procurement into Product Designs
World Seport
From the US: Product Designs for Emerging Markets Differ from Those for Advanced Nations
News
- Panasonic Proposes 3D-Compatible Specifications for Blu-ray Disc
- The First Android Phone and Version 1.0 of the Android SDK Are Announced Simultaneously
- Hollywood Studios and Consumer Electronics Companies Will Create a Content Distribution Specification
- Debut of New FPGAs Using Asynchronous Circuit Technology
- Automakers Begin Evaluating Possibility of Using Next-Generation SiC Power Semiconductor Devices
