Revolution of Compact Line

--To Strengthen Japanese Manufacturing Industry

Product Details

Language
English
Format
PDF
File Size
4.09 MB
Print Length
71 Pages
Publisher
Nikkei Business Publications,Inc.
Published
June 2014
Delivery
Immedate Download

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Report Description

The Strong Factory Project: a project Nikkei Monozukuri is proceeding with to assist Japanese factories. In the past, we have featured factory managers in the January 2013 issue and cutting-edge factories with unique buildings and facilities in the May 2013 issue. In this third feature, we will focus on production lines, which are the core of a facility. Through interviews we found that domestic manufacturers are trying to make their production lines compact using approaches such as reduction and shortening of processes. Their target reduction rates are much higher than before. Some manufacturers have generated innovative ideas that aim to reduce their investment costs to one thousandth of what they were before. We report on the latest trends of compact lines aiming at revolutionary evolution

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Table of contents

Introduction: Growing expectations for compact lines

Attainment of high speed and low cost even in multiproduct variable quantity production Innovative idea that eliminates the mass production effect

Part 1: New Trend 6

Attainment of high speed and low cost even in multiproduct variable quantity production Innovative idea that eliminates the mass production effect

Part 2: Case Examples 11

Yorii Plant of Honda Motor Co., Ltd. / Hosoya Plant of Taiho Kogyo Co., Ltd. / Saitama Plant of Tsubakimoto Chain Co. / Nishio Plant of Denso Corporation / Akashi Plant of Kawasaki Heavy Industries, Ltd. / Nagaoka Technical Center of TDK-Lambda Corporation

Part 3: Minimal Fab –Multiproduct Variable Quantity 58

Semiconductor factory that specializes in small-scale production Capital investment lowered to one thousandth, 500 million yen

Figures:

Part 1

Fig. Compact line, which Japanese manufactures are rushing to introduce

Part 2

Case 1: Yorii Plant of Honda Motor Co., Ltd.

Fig. 1 Compact line for vehicle body coating
Fig. 2 New Fit (back) and Fit Hybrid (front)
Fig. 3 Body coating line
Fig. 4 Coating film structure
Fig. 5 Inner frame skeleton
Fig. 6 Body welding line
Fig. 7 Spot welding robot
Fig. A Compact line for Hot Stamping
Fig. B Structure of die that allows for elimination of laser processing

Case 2: Hosoya Plant of Taiho Kogyo Co., Ltd.

Fig. 1 RR line in Hosoya Plant of Taiho Kogyo
Fig. 2 Engine bearing
Fig. 3 Robot in RR line
Fig. 4 RR line 50% shorter than conventional line

Case 3: Saitama Plant of Tsubakimoto Chain Co.

Fig. 1 Production line of engine timing chain
Fig. 2 Tsubakimoto Chain's new plant building that started operation in April 2013
Fig. 3 Available space generated in the conventional line

Case 4: Nishio Plant of Denso Corporation

Fig. 1 Comparison of new and conventional casting part production method of Denso
Fig. 2 Die and production item exchanged in one minute
Fig. 3 1/N small die-casting integrated with furnaces
Fig. 4 Low pressure casting attained by temperature maintenance due to direct feed of molten metal
Fig. 5 Ingot weight increment reduced to 100g
Fig. 6 Heat treatment furnace having special internal structure

Case 5: Akashi Plant of Kawasaki Heavy Industries, Ltd.

Fig. 1 Motorcycle assembly line
Fig. 2 Structure of compact line
Fig. 3 Subassembly process
Fig. 4 Structure of parts cart system
Fig. 5 Assembly line

Case 6: Nagaoka Technical Center of TDK-Lambda Corporation

Fig. 1 Substrate-type power supply ZWS-BP
Fig. 2 Production line of switching power supply
Fig. 3 Comparison of assembly/inspection line
Fig. 4 Mounted surface of lead components
Fig. 5 Mounted surface of chip components

Part 3

Fig. 1 Suitable production volume for each wafer diameter
Fig. 2 Equipment investment reduced to one thousandth
Fig. 3 Conveying a wafer using a container excellent in sealability
Fig. 4 Particles per hour of all diameters can be reduced to zero
Fig. 5 Attainment of level where clean room is unnecessary
Fig. 6 Prospect for uniform application
Fig. 7 Digital Mirror Device (DMD) is employed as an exposure system
Fig. 8 Line width (L) and interval space (S) of approximately 1 micrometer can be resolved
Fig. 9 Result of wafer entire surface exposure
Fig. 10 Development Road Map of Minimal Fab

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