Nikkei Electronics Asia -- March 2009

Nikkei Electronics Asia-March 2009
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Cover Story

Rejuvenation Scenario for Chip Companies

In a number of advanced semiconductor fields, including microprocessors, NAND Flash memory and dynamic random access memory (DRAM), the difference in competitiveness between the industry leader and rest of the pack is growing. As the global financial crisis leads to shrinking demand and surging capital loads, competition based on corporate resources is intensifying.


Analysis

CES Roundup: Equipment Makers Play for Survival

International CES is held every year, showcasing all the latest trends in electronic equipment. This year, reflecting the economic situation, the number of attendees had dropped by about 20% to about 110,000. Even so, the show still gave a taste of the development lab for cutting-edge electronics, and was far more active than many had been expecting.


Latest

Restructuring Imminent for Semiconductor, TV Industries

Features

Next-Gen HDMI Expands Range of Applications

IBM Develops 22nm SRAM; Moore's Law Back on Track

Hybrid Cars Evolve in Different Directions

Columns

Design View from Japan: ASP-DAC 2009 Features Special HDS Session

Wireless Focus: RFID Enjoys Widespread Industry Adoption

Pins & Vias: Wafer-Level Packaging Makes Systems Smaller

Reports

Avnet Focuses on Core Values in Difficult Times

Blue LED Improves Light Output, Efficiency

Graphene Films Realize Stretchable Devices

PEDL Technology Benefits Copper Low-k Packaging

India Focus

Global Crisis Halves India's Semiconductor Growth

Wi-Fi Gets Smart Grid Connectivity

Dexcel Set to Carve Niche!

India Focus: Briefs

Insights

Testing with Arbitrary Function Pulse Generators

Trends in RF Testing

Strategies for Maximizing Test System Efficiency

Solutions

MDDI-to-MIPI Device Bridges Serial Display Standards Gap

Current Limits of Solid-State Overcurrent Protection ICs