Nikkei Electronics Asia -- September 2007

Nikkei Electronics Asia-September 2007 Cover Story

Home Networking: Building a Foundation

Interoperability between equipment is becoming a reality. Several companies have released media players, TVs and other products compliant with the DLNA home network standard. But will the potential of home networks ever be fully realized?

Analysis-1

EMC Inside Systems Adds Noise Problems

Slower wireless LAN connection speeds, the inability to pick up single-segment broadcasts - these are the types of problem associated with electromagnetic compatibility (EMC) inside equipment, an area now of great interest to designers.

Analysis-2

NAND Flash Memory Growth Accelerates

Development of NAND Flash memory is accelerating. At the 2007 Symposium on VLSI Technology/Circuits, details of technologies for 64-Gbit chips were revealed, along with new cell stacking technologies.

Feature

Component, PCB Warpage Becomes Packaging Issue

2D Communication System Uses Nearfields, Microwaves

Honda Soltec Releases CIGS-Type Solar Cells

MEI's UniPhier 2 Enhances Equipment Interactions

Murata Develops 10mm Sq Mobile WiMAX Module

USB-IF Compliance Workshop Cancelled

Design View from Japan

Cadence Event Features User Product Evaluations

Wireless Focus

IR, RF Remotes Hot for Home Installations

Pins & Vias

MEMS Technology Widens Appeal

Insights

Detecting Leakage Problems in Low-Power Designs

Verification Challenges Facing Analog, RF Designers

Correlating Time-Domain Jitter with Phase Noise

New Substrate Technology Reduces Chip Size, Cost

Report

Scientists Inject Electrical Spin into Si

Subscription PC Runs Linux on VIA Chipset

Software Engineers Sharpen Hardware Skills

3ALogics Positions for RF IC Market Growth

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