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HOME > from Magazines > Nikkei Electronics Asia -- April 2007

Nikkei Electronics Asia -- April 2007

Nikkei Electronics Asia-April 2007 Cover Story

Vertical Stacking to Redefine Chip Design

Enormous changes are about to happen that will influence the future of LSI. The shift from horizontal to vertical stacking of circuits has the potential to rewrite the conventions of electronics design.

Analysis

IEEE802 Committee "on Brink of Collapse"

The IEEE 802 LAN/MAN Standards Committee, the group drawing up standards for wired and wireless LANs, has become embroiled in cynical in-fighting. Can it survive and remain relevant?


Columns

Multicore Design Issues

Yokohama Hosts IC Design Conference

Features

New Optical Disc Standards Target BRIC Nations

White LED Offers Emission Efficiency Up to 150lm/W

DisplayPort to Coexist with HDMI

1-Tbit HDDs Achieved with Nanoholes at 25nm Pitch

Li-Ion Battery Boosts Capacity with New Anode

ICP Features Wafer-Level CSP, PoP

Insights

PTC Thermistors as Auxiliary Heating Units for Automobiles

Digital Isolation: A Compact Solution to Design Problems

Undershoot, Overshoot Limits for Buck Regulators

Current Sensing in Automotive Applications

Reports

Electronic Textiles Made More Resilient, Versatile

HAVA Enables High-Quality Wireless Video Streaming

Super-Thin Laser Mirror to Improve Consumer Devices

SiRF Expands into Handset Sector

India's EMS Industry: The Road Ahead

Samsung Invests Heavily in HD Technology

India's Leading Chip Exporter Sees Opportunity at Home

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