Nikkei Electronics Asia -- February 2007

Cover Story

Volume-Cost Strategy Puts Chip Makers Back on Top

Semiconductor manufacturers, floundering until recently, have been able to improve their cost competitiveness by producing in volume, achieving the lowest possible cost, and investing profits back into their business.

Tech Analysis

Chip-on-Chip Offers Higher Memory Capacity, Speed

Chip-on-chip (CoC) semiconductor packaging technology offers high performance at low cost for a range of equipment, including digital household appliances, mobile gear, servers and routers.

Columns

Broadcom Targets Cell Phones

Japanese Semiconductor Manufacturers Enter India

Tech Feature

Aplix Virtualizing Technology Boosts Mobile Phone Security

Aichi Steel Develops Low-Cost, Miniature Magnetism Sensor

PS3 IC Packaging: Innovation for Volume Production

Blue First: High-Output LEDs on Si Substrate

Phase-Change Memory Switch 500x Faster than Flash

ULC Mobile Phones Reach Markets

6Gbps Achieved over Wireless Point-to-Point Connection

ITU Telecom World 2006: "Living the Digital World"

WirelessHD Group to Connect HDTV in Millimeter-Wave Band

65nm-Generation FPGAs to Replace Cell-Based ICs

Monthly Special

Intelligent Color Engine to Make TFT-LCD High-Definition Display

Choosing Appropriate Hardware IP for FPGA-ASIC Conversion

Video Signal Interfacing via AC, DC Coupling

Industry & Market

PMC-Sierra Steps Up Activities in China

Headset Makers Look to PDA Phones to Drive Growth

Infineon: Innovation Key to Robust Performance

Fusion Memory Advances as Core Function of System

SiRF India Packs More Functions onto Standalone GPS Chips

Rolls-Royce, Metalysis to Set Up Tantalum Plant

TI: Pace of Analog Growth Quickens in India

NIKKEI ERECTRONICS ASIA

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