Nikkei Electronics Asia - June 2004
- Micronas, Genesis Microchip Announce Joint Reference Design
- Speedline Allied with GIT for Printing Technology
- Fujitsu, Wi-LAN to Debut WiMAX-Certified System
- Elbit Systems, Gilat Cooperate for Satellite Networking
- Mercury, Tundra Unveil Serial RapidIO AdvancedTCA Platform
- Philips Introduces Reference Design for Digital Amplifier
- Renesas to Co-Develop CellularRAM Product Specification
- IDT to Address Advanced Serial Switching, PCI Express Solutions
- Equipment Makers Record 1.10 Book-to-Bill Ratio in March
- Taiwan's WLAN Shipments Slowed in First Quarter
- AMD to Build Test, Mark, Package Facility in China
- ASAT, HKSTP to Promote IC Packaging, Design, Test Services
- Molex Acquires Cinch's Connector Business in Europe
- Siebel Systems, Teradata Partner for Analytic Applications
- Joint Venture to Promote Double-Layer Capacitor System
- AMD Opens APM Innovation Centers in Germany
- Infineon to Expand DRAM Capacity in Virginia Plant
- Wireless USB Enables Secure Connection at 480Mbps
- 3G Phones Continue to Evolve
- Chinese Standards: From Optical Disks to Encoding
- GENISSNX Helps Makers Understand Packaging, Costs
- Recovery in Full Evidence
- Integration Threatens Processor Vendors
- Double-Layer Capacitor Offers Ease of Rechargeable Batteries
- New Analysis Technique Advances RoHS Targets
- Laser-Free Range Measurement Method Uses Imager, LED
- Avaya Expands SiP's Presence in Real World
- SoC Verification Proves Suprisingly Difficult
- Technology, Design Issues for HDD SoC
- Hitachi GST Expands Production in China
- Tyco Electronics Explores China Market
- AnalogicTech Opens New HQ on HKSTP
- PDA Thrives Despite Smartphone Challenges
- ILOG's JRules Eases Production Processes
- Samsung Develops Ultra-Small DMB Tuner
- Indian R&D Center Develops TETRA Solution
- DAB Opens New Doors for Consumer Electronics















