Nikkei Electronics Asia - September 2002
- China to Match India in Software Services Revenue
- Legerity to Acquire Agere Line Card Business
- CPS, Samsung Announce E-OTD Handset Integration
- Hitachi Samples 1Gb Flash Memory
- 150 celsius Conductive Adhesive for 0.2mm Line Space
- ST Develops New LightFlash Memory Family
- Intel Establishes Working Group for 3D Web Standards
- Bluetooth Applied to Ticketing, Videoconferencing
- Skywave VoIP Software Makes PDA Phone
- Philips, Telephonetics Enter Partnership
- 3Com Announces Wireless Building-to-Building Bridge
- AMD, Fujitsu, Saifun Semi Announce Collaboration
- [Cover Story] C Language in Chip Design Shortens Time-to-Market
- Oz "Silicon Valley" to be Established
- Going Strong in Analog Design
- Matsushita SiGe MOS Transistor Lowers Power Supply
- Dynalith Launches Verification Solution
- Motorola to Move Flip-Chip, QFP to Malaysia
- 3M Boosts Photonics Role
- PSB Opens SAR, Bluetooth Test Labs
- DELL Opens Office in Hanoi
- DDR Memories Conquer DRAM Market
- US Mobile Internet Firms Adopt Japanese Model
- BenQ Aims at Growth Markets
- [EDA Edge] Managing Connected Devices Poses New Challenge
- SystemC 3.0 Supports Dynamic Reconfigurable Design
- [Pins & Vias] Microvias Go Mainstream
- DVD Drives Support Multiple Rewritable Standards
- Piercing the Low Cost Die Attach Barrier
- Continuous Improvement Strategies for Automated X-Ray Inspection
- High-Speed Interface Boosts Multimedia Quality
- Asia at 3G Forefront
- A Revolution in Embedded Operating Systems?
- Intel Moves Ahead with New Processors
- Application Development Time Slashed to 1/20
- [Trade Shows] Integration Theme at CommunicAsia 2002















