Nikkei Electronics Asia - June 2002

• Altera, TSMC Collaborate on 90nm PLD Technology
• TCL Smartphone Based on Intel PCA Building Blocks
• Philips Offers MHP Solution to Electronics Manufacturers
• KDDI Rolls out CDMA2000 1x Service in Japan
• Intrinsity 2GHz Signal Processors Shipped in Fall
• Intel to Give Guidance On Desktop Form Factors
• LSI Logic Library, Cores Proven for 90nm Process
• Axell Video Decoder Offers 100M Dots/s Rendering
• AMIS Acquires ST's Mixed-Signal Business
• IR's New Dual HEXFET Power MOSFETs
• Motorola, Siemens Join Forces on UMTS Terminals
• National, Vitesse to Develop Gbit Ethernet Solutions
• Xilinx Unveils Open Protocol Initiative
• MoSys Licenses 1T-SRAM Technology to Philips
• RSA Security Certifies Software for RSA SecurID
• Inmarsat Delivers Internet Services to Air Passengers
• Mobile Pentium 4 Boosts Performance of Laptops
• SOMA Networks Partners with France Telecom
• TI, IDT, Hitachi Introduce New QFN Packaging
• [Cover Story] OFDM Spreads to Broadband Communication
• LCD Interconnect Technology Uses Copper
• Growth in Chip Industry Expected
• STATS Targets US with FastRamp
• Approval for IC Fabs in China
• Cisco Opens New World Workplace
• CSIRO Unravels Secrets of Sound
• Cookson Electronics Enters China
• Chips, Cores for Telecom, Multimedia
• Matsushita Recycles 60-70% of Appliance Parts
• [China Special] ZTE Gets Next-Generation CDMA Ready
• [China Special] Singapore Firms Enter China's Marketplace
• [China Special] NEC Bolsters Design Capability in China
• [China Special] Agilent Taps into China's Wireless Market
• [China Special] IDT Speeds Telecom Roadmap via China Acquisition
• [China Special] Internet Drives ON Semi Expansion in China
• [China Special] UIC Positions China as Global Production Hub
• [Pins & Vias] Stacked CSP Takes Off
• Taiwan Moves Towards 90nm Process Technology
• Matsushita Speaker Emits Sound from FPD
• Philips Achieves 2.5mm x 3mm Logic IC Package
• [Point-to-Point] Modular Solution for Modern SMEs
• 10Gbps Optical Transceiver on Sapphire Substrate
• Offshore R&D Divisions Lured to China
• [Trade Shows] CeBIT Reflects Evolution of Portable Devices
• [Trade Shows] SEMICON China Scrutinizes Manufacturing Issues
• China Needs Ubiquitous Internet Infrastructure
• [MicroTech Watch] Security Issues Heat Up
• Aplix Develops Java Application Accelerator
• Optimal 10Gb Interface Standard Simplifies Component Interconnect
• Jitter in Digital Communication Systems
• Understanding SONET Jitter Specifications

• Fujitsu President Shows Positive Stance Toward Tie-up With Renesas, Panasonic
• Mazda Employs Crash Prevention Technology for SUV
• [AABC] Panasonic, GS Yuasa Speak of Stationary Storage Batteries
• [AABC] Samsung Yokohama Discusses Performance Improvement of Li-ion Batteries
• Toshiba's 'SCiB' Li-ion Battery Employed for Elevator
• Elpida President Discusses DRAM Industry's Future

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