AMD, UMC Collaborate on 300mm Wafer Fab

April 2002 Issue


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AMD and UMC have announced a comprehensive alliance under which the two companies will establish a joint venture to own and operate a state-of-the-art, 300mm wafer fabrication facility in Singapore for high-volume production of PC processors and other logic products.

AMD and UMC also announced plans to collaborate in the development of advanced process technologies for semiconductor logic products.

The two companies separately announced a foundry agreement under which UMC will produce PC processors to augment AMD's Dresden Fab 30 production capacity for devices produced on 130 nanometer (and smaller) geometry technology.

AMD and UMC will form a joint venture known as AU Pte Ltd, to own and operate the Singapore facility. The two companies expect to begin commercial production in the joint venture facility on 65-nanometer technology in mid-2005.

(April 2002 Issue, Nikkei Electronics Asia)
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